ZIPSTM32+BC260Y+DHT11 上报温湿度数据至OneNET 3.42MB

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资源文件列表:

Project_temp_bc260y.zip 大约有170个文件
  1. Project_temp_bc260y/
  2. Project_temp_bc260y/CORE/
  3. Project_temp_bc260y/CORE/core_cm3.c 16.87KB
  4. Project_temp_bc260y/CORE/core_cm3.h 83.71KB
  5. Project_temp_bc260y/CORE/startup_stm32f10x_hd.s 15.14KB
  6. Project_temp_bc260y/CORE/startup_stm32f10x_md.s 12.47KB
  7. Project_temp_bc260y/HARDWARE/
  8. Project_temp_bc260y/HARDWARE/DHT11/
  9. Project_temp_bc260y/HARDWARE/DHT11/dht11.c 2.7KB
  10. Project_temp_bc260y/HARDWARE/DHT11/dht11.h 547B
  11. Project_temp_bc260y/HARDWARE/LED/
  12. Project_temp_bc260y/HARDWARE/LED/led.c 556B
  13. Project_temp_bc260y/HARDWARE/LED/led.h 121B
  14. Project_temp_bc260y/NET/
  15. Project_temp_bc260y/NET/BC260Y/
  16. Project_temp_bc260y/NET/BC260Y/BC260Y.c 3.73KB
  17. Project_temp_bc260y/NET/BC260Y/BC260Y.h 960B
  18. Project_temp_bc260y/NET/BC260Y/BC260Y_bak.c 6.21KB
  19. Project_temp_bc260y/NET/BC260Y/BC260Y_bak.h 1.18KB
  20. Project_temp_bc260y/OBJ/
  21. Project_temp_bc260y/OBJ/DS18B20.axf 507.85KB
  22. Project_temp_bc260y/OBJ/DS18B20.build_log.htm 1.68KB
  23. Project_temp_bc260y/OBJ/DS18B20.hex 36.74KB
  24. Project_temp_bc260y/OBJ/DS18B20.htm 97.35KB
  25. Project_temp_bc260y/OBJ/DS18B20.lnp 581B
  26. Project_temp_bc260y/OBJ/DS18B20.sct 494B
  27. Project_temp_bc260y/OBJ/DS18B20_sct.Bak 494B
  28. Project_temp_bc260y/OBJ/ExtDll.iex 19B
  29. Project_temp_bc260y/OBJ/Project_Target 1.dep 27.88KB
  30. Project_temp_bc260y/OBJ/TEMP_Target 1.dep 33.08KB
  31. Project_temp_bc260y/OBJ/bc260y.crf 348.57KB
  32. Project_temp_bc260y/OBJ/bc260y.d 1.9KB
  33. Project_temp_bc260y/OBJ/bc260y.o 382.41KB
  34. Project_temp_bc260y/OBJ/core_cm3.crf 3.85KB
  35. Project_temp_bc260y/OBJ/core_cm3.d 104B
  36. Project_temp_bc260y/OBJ/core_cm3.o 10.87KB
  37. Project_temp_bc260y/OBJ/delay.crf 340.13KB
  38. Project_temp_bc260y/OBJ/delay.d 1.63KB
  39. Project_temp_bc260y/OBJ/delay.o 372.67KB
  40. Project_temp_bc260y/OBJ/dht11.crf 340.99KB
  41. Project_temp_bc260y/OBJ/dht11.d 1.67KB
  42. Project_temp_bc260y/OBJ/dht11.o 375.05KB
  43. Project_temp_bc260y/OBJ/esp8266.crf 347.41KB
  44. Project_temp_bc260y/OBJ/esp8266.d
  45. Project_temp_bc260y/OBJ/lcd.crf 400.85KB
  46. Project_temp_bc260y/OBJ/lcd.d 1.79KB
  47. Project_temp_bc260y/OBJ/lcd.o 434.48KB
  48. Project_temp_bc260y/OBJ/led.crf 339.55KB
  49. Project_temp_bc260y/OBJ/led.d 1.56KB
  50. Project_temp_bc260y/OBJ/led.o 371.49KB
  51. Project_temp_bc260y/OBJ/main.crf 350.28KB
  52. Project_temp_bc260y/OBJ/main.d 1.79KB
  53. Project_temp_bc260y/OBJ/main.o 381.86KB
  54. Project_temp_bc260y/OBJ/misc.crf 339.11KB
  55. Project_temp_bc260y/OBJ/misc.d 1.58KB
  56. Project_temp_bc260y/OBJ/misc.o 370.26KB
  57. Project_temp_bc260y/OBJ/mqttkit.crf 358.26KB
  58. Project_temp_bc260y/OBJ/mqttkit.d
  59. Project_temp_bc260y/OBJ/onenet.crf 357.92KB
  60. Project_temp_bc260y/OBJ/onenet.d
  61. Project_temp_bc260y/OBJ/startup_stm32f10x_hd.d 63B
  62. Project_temp_bc260y/OBJ/startup_stm32f10x_hd.o 6.65KB
  63. Project_temp_bc260y/OBJ/stm32f10x_gpio.crf 342.52KB
  64. Project_temp_bc260y/OBJ/stm32f10x_gpio.d 1.9KB
  65. Project_temp_bc260y/OBJ/stm32f10x_gpio.o 376.54KB
  66. Project_temp_bc260y/OBJ/stm32f10x_it.crf 338.52KB
  67. Project_temp_bc260y/OBJ/stm32f10x_it.d 1.76KB
  68. Project_temp_bc260y/OBJ/stm32f10x_it.o 370.59KB
  69. Project_temp_bc260y/OBJ/stm32f10x_rcc.crf 346.02KB
  70. Project_temp_bc260y/OBJ/stm32f10x_rcc.d 1.87KB
  71. Project_temp_bc260y/OBJ/stm32f10x_rcc.o 380.9KB
  72. Project_temp_bc260y/OBJ/stm32f10x_usart.crf 344.59KB
  73. Project_temp_bc260y/OBJ/stm32f10x_usart.d 1.93KB
  74. Project_temp_bc260y/OBJ/stm32f10x_usart.o 380.58KB
  75. Project_temp_bc260y/OBJ/sys.crf 339.35KB
  76. Project_temp_bc260y/OBJ/sys.d 1.53KB
  77. Project_temp_bc260y/OBJ/sys.o 372.64KB
  78. Project_temp_bc260y/OBJ/system_stm32f10x.crf 340.2KB
  79. Project_temp_bc260y/OBJ/system_stm32f10x.d 1.85KB
  80. Project_temp_bc260y/OBJ/system_stm32f10x.o 370.49KB
  81. Project_temp_bc260y/OBJ/usart.crf 348.98KB
  82. Project_temp_bc260y/OBJ/usart.d 1.85KB
  83. Project_temp_bc260y/OBJ/usart.o 381.06KB
  84. Project_temp_bc260y/README.TXT
  85. Project_temp_bc260y/STM32F10x_FWLib/
  86. Project_temp_bc260y/STM32F10x_FWLib/inc/
  87. Project_temp_bc260y/STM32F10x_FWLib/inc/misc.h 8.77KB
  88. Project_temp_bc260y/STM32F10x_FWLib/inc/stm32f10x_adc.h 21.18KB
  89. Project_temp_bc260y/STM32F10x_FWLib/inc/stm32f10x_bkp.h 7.38KB
  90. Project_temp_bc260y/STM32F10x_FWLib/inc/stm32f10x_can.h 26.91KB
  91. Project_temp_bc260y/STM32F10x_FWLib/inc/stm32f10x_cec.h 6.42KB
  92. Project_temp_bc260y/STM32F10x_FWLib/inc/stm32f10x_crc.h 2.11KB
  93. Project_temp_bc260y/STM32F10x_FWLib/inc/stm32f10x_dac.h 14.88KB
  94. Project_temp_bc260y/STM32F10x_FWLib/inc/stm32f10x_dbgmcu.h 3.73KB
  95. Project_temp_bc260y/STM32F10x_FWLib/inc/stm32f10x_dma.h 20.27KB
  96. Project_temp_bc260y/STM32F10x_FWLib/inc/stm32f10x_exti.h 6.66KB
  97. Project_temp_bc260y/STM32F10x_FWLib/inc/stm32f10x_flash.h 24.85KB
  98. Project_temp_bc260y/STM32F10x_FWLib/inc/stm32f10x_fsmc.h 26.38KB
  99. Project_temp_bc260y/STM32F10x_FWLib/inc/stm32f10x_gpio.h 19.7KB
  100. Project_temp_bc260y/STM32F10x_FWLib/inc/stm32f10x_i2c.h 29.33KB
  101. Project_temp_bc260y/STM32F10x_FWLib/inc/stm32f10x_iwdg.h 3.74KB
  102. Project_temp_bc260y/STM32F10x_FWLib/inc/stm32f10x_pwr.h 4.28KB
  103. Project_temp_bc260y/STM32F10x_FWLib/inc/stm32f10x_rcc.h 29.74KB
  104. Project_temp_bc260y/STM32F10x_FWLib/inc/stm32f10x_rtc.h 3.77KB
  105. Project_temp_bc260y/STM32F10x_FWLib/inc/stm32f10x_sdio.h 21.35KB
  106. Project_temp_bc260y/STM32F10x_FWLib/inc/stm32f10x_spi.h 17.31KB
  107. Project_temp_bc260y/STM32F10x_FWLib/inc/stm32f10x_tim.h 51.2KB
  108. Project_temp_bc260y/STM32F10x_FWLib/inc/stm32f10x_usart.h 16.16KB
  109. Project_temp_bc260y/STM32F10x_FWLib/inc/stm32f10x_wwdg.h 2.9KB
  110. Project_temp_bc260y/STM32F10x_FWLib/src/
  111. Project_temp_bc260y/STM32F10x_FWLib/src/misc.c 6.88KB
  112. Project_temp_bc260y/STM32F10x_FWLib/src/stm32f10x_adc.c 46.09KB
  113. Project_temp_bc260y/STM32F10x_FWLib/src/stm32f10x_bkp.c 8.26KB
  114. Project_temp_bc260y/STM32F10x_FWLib/src/stm32f10x_can.c 44.05KB
  115. Project_temp_bc260y/STM32F10x_FWLib/src/stm32f10x_cec.c 11.38KB
  116. Project_temp_bc260y/STM32F10x_FWLib/src/stm32f10x_crc.c 3.27KB
  117. Project_temp_bc260y/STM32F10x_FWLib/src/stm32f10x_dac.c 18.64KB
  118. Project_temp_bc260y/STM32F10x_FWLib/src/stm32f10x_dbgmcu.c 5.03KB
  119. Project_temp_bc260y/STM32F10x_FWLib/src/stm32f10x_dma.c 28.91KB
  120. Project_temp_bc260y/STM32F10x_FWLib/src/stm32f10x_exti.c 6.8KB
  121. Project_temp_bc260y/STM32F10x_FWLib/src/stm32f10x_flash.c 61.08KB
  122. Project_temp_bc260y/STM32F10x_FWLib/src/stm32f10x_fsmc.c 34.65KB
  123. Project_temp_bc260y/STM32F10x_FWLib/src/stm32f10x_gpio.c 22.68KB
  124. Project_temp_bc260y/STM32F10x_FWLib/src/stm32f10x_i2c.c 44.71KB
  125. Project_temp_bc260y/STM32F10x_FWLib/src/stm32f10x_iwdg.c 4.8KB
  126. Project_temp_bc260y/STM32F10x_FWLib/src/stm32f10x_pwr.c 8.55KB
  127. Project_temp_bc260y/STM32F10x_FWLib/src/stm32f10x_rcc.c 50.07KB
  128. Project_temp_bc260y/STM32F10x_FWLib/src/stm32f10x_rtc.c 8.4KB
  129. Project_temp_bc260y/STM32F10x_FWLib/src/stm32f10x_sdio.c 28.25KB
  130. Project_temp_bc260y/STM32F10x_FWLib/src/stm32f10x_spi.c 29.52KB
  131. Project_temp_bc260y/STM32F10x_FWLib/src/stm32f10x_tim.c 106.6KB
  132. Project_temp_bc260y/STM32F10x_FWLib/src/stm32f10x_usart.c 37.41KB
  133. Project_temp_bc260y/STM32F10x_FWLib/src/stm32f10x_wwdg.c 5.6KB
  134. Project_temp_bc260y/SYSTEM/
  135. Project_temp_bc260y/SYSTEM/delay/
  136. Project_temp_bc260y/SYSTEM/delay/delay.c 7.4KB
  137. Project_temp_bc260y/SYSTEM/delay/delay.h 1.94KB
  138. Project_temp_bc260y/SYSTEM/sys/
  139. Project_temp_bc260y/SYSTEM/sys/sys.c 423B
  140. Project_temp_bc260y/SYSTEM/sys/sys.h 2.74KB
  141. Project_temp_bc260y/SYSTEM/usart/
  142. Project_temp_bc260y/SYSTEM/usart/usart.c 6.62KB
  143. Project_temp_bc260y/SYSTEM/usart/usart.h 433B
  144. Project_temp_bc260y/SYSTEM/usart_bak/
  145. Project_temp_bc260y/SYSTEM/usart_bak/usart.c 4.39KB
  146. Project_temp_bc260y/SYSTEM/usart_bak/usart.h 1.25KB
  147. Project_temp_bc260y/SYSTEM/usart_bak2/
  148. Project_temp_bc260y/SYSTEM/usart_bak2/usart.c 5.78KB
  149. Project_temp_bc260y/SYSTEM/usart_bak2/usart.h 365B
  150. Project_temp_bc260y/USER/
  151. Project_temp_bc260y/USER/DS18B20.map 135.96KB
  152. Project_temp_bc260y/USER/DebugConfig/
  153. Project_temp_bc260y/USER/DebugConfig/Target_1_STM32F103C6_1.0.0.dbgconf 6.79KB
  154. Project_temp_bc260y/USER/DebugConfig/Target_1_STM32F103C8_1.0.0.dbgconf 6.79KB
  155. Project_temp_bc260y/USER/DebugConfig/Target_1_STM32F103RC_1.0.0.dbgconf 6.79KB
  156. Project_temp_bc260y/USER/EventRecorderStub.scvd 339B
  157. Project_temp_bc260y/USER/JLinkLog.txt 182.43KB
  158. Project_temp_bc260y/USER/JLinkSettings.ini 578B
  159. Project_temp_bc260y/USER/Project.uvguix.ATMK 175.11KB
  160. Project_temp_bc260y/USER/Project.uvoptx 13.06KB
  161. Project_temp_bc260y/USER/Project.uvprojx 17.17KB
  162. Project_temp_bc260y/USER/main.c 1.16KB
  163. Project_temp_bc260y/USER/startup_stm32f10x_hd.lst 49.87KB
  164. Project_temp_bc260y/USER/stm32f10x.h 619.08KB
  165. Project_temp_bc260y/USER/stm32f10x_conf.h 3.16KB
  166. Project_temp_bc260y/USER/stm32f10x_it.c 2.36KB
  167. Project_temp_bc260y/USER/stm32f10x_it.h 1.94KB
  168. Project_temp_bc260y/USER/system_stm32f10x.c 35.72KB
  169. Project_temp_bc260y/USER/system_stm32f10x.h 2.04KB
  170. Project_temp_bc260y/keilkilll.bat 399B

资源介绍:

STM32+BC260Y+DHT11 上报温湿度数据至OneNET的知识点涵盖了许多领域，包括微控制器、物联网模块、传感器、通信协议以及云端平台的使用。以下将详细介绍这些关键组成部分及其相互作用。 1. STM32F103C8T6：这是意法半导体（STMicroelectronics）生产的STM32系列微控制器，基于ARM Cortex-M3内核。它具有高性能、低功耗的特点，适用于各种嵌入式应用，如本案例中的数据采集和处理。STM32F103C8T6拥有丰富的外设接口，如UART、SPI和I2C，便于与各种传感器和模块进行通信。 2. BC260Y：这是一款窄带物联网（NB-IoT）模块，用于实现远程无线通信。NB-IoT是一种新兴的蜂窝网络技术，特别适合低功耗、广覆盖的物联网应用。BC260Y支持GSM、UMTS和LTE网络，能够连接到OneNET等云服务平台，实现设备的远程数据传输和控制。 3. DHT11：这是一种常见的数字温湿度传感器，能同时测量环境温度和湿度，并通过单总线（One-Wire）接口将数据发送给微控制器。DHT11具有成本低、易于使用的特点，但精度相比专业级传感器较低，适合家庭或一般环境监测。 4. MQTT（Message Queuing Telemetry Transport）：这是一种轻量级的发布/订阅消息协议，广泛用于物联网应用。在本项目中，STM32通过MQTT协议将DHT11采集的温湿度数据发送给BC260Y，然后BC260Y再将数据上传到OneNET云端平台。MQTT协议具有低带宽占用、高可靠性以及对网络质量要求较低的优点，非常适合物联网环境。 5. OneNET：这是中国移动推出的一个开放的物联网云服务平台，提供数据接入、存储、分析和应用开发等服务。开发者可以使用OneNET API和SDK来构建自己的物联网应用，例如监控和分析温湿度数据，或者触发特定条件下的报警和自动化操作。 项目文件"Project_temp_bc260y"可能包含以下内容： - 代码文件：实现了STM32与BC260Y、DHT11的通信，以及通过MQTT协议上传数据到OneNET的程序。 - 配置文件：如物联网平台的接入密钥、设备ID等配置信息。 - 数据库脚本：可能用于存储和查询上传到OneNET的数据。 - 文档：项目介绍、硬件连接图、编程指南等。 这个项目展示了如何利用STM32微控制器、NB-IoT模块、温湿度传感器和MQTT协议，将实时环境数据上报至云端平台，从而实现物联网应用的基础架构。这对于学习嵌入式开发、物联网技术和云服务的初学者来说是一个很好的实践案例。
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